Certain applications within the computing world require extraordinary hardware, and sometimes it’s about how small they can become while maintaining tip-top performance. And one of such requirements are from ultrabooks, whose edge AI technology made them into intelligent real-time terminals and far beyond their traditional role as productivity tools.
To support such a use case, Biwin’s newly introduced Mini SSD is here to tick all the checkboxes.
To start, this drive is created through advanced LGA packaging to shrink the module down to just 15×17×1.4mm, which is only 8.3% of a standard M.2 2280 SSD. Thus, this opens up more spaces for better component integration, allowing for larger batteries, enhanced cooling systems, and room for AI-specific hardware like NPUs and LiDAR sensors. The result is a more capable ultrabook with improved support for on-device AI tasks.
Not only that, the industry is currently transitioning from soldered storage towards a “hotswap” ideology where the Mini SSD wholly supports this through its modular, slot-based architecture to offer more flexibility in terms of storage upgrade while enhancing the general product lifecycle of the full product.
As for performance, it can achieve upwards of 3700MB/s read and 3400MB/s write via PCIe 4.0 x2 protocol, while capacities can go as large as 2TB, which is the sweet spot for current-day demands. And yes, it comes with dynamic SLC caching so no drastic performance drops on full loads.
In short, the Biwin Mini SSD not only delivers the brand’s innovative ways of designing products that can shift industries but also matches the requirements of users through the freedom to scale on demand.