ASUS has confirmed its participation as an exhibitor at the 2024 OCP Global Summit, taking place at the San Jose Convention Center.

ASUS OCP Global Summit Showcase

At the event, ASUS will highlight its latest server-grade hardware, including AMD’s new EPYC 9005 processors and Instinct MI325X accelerators. One of the featured models is the ESC A8A-E12U, a 7U server equipped with two EPYC processors and eight Instinct accelerators. The MI325X stands out with 256GB of high-bandwidth memory (HBM) and up to 6TB/s of bandwidth, making it ideal for large AI models and high-performance computing (HPC) tasks. It also supports direct GPU-to-GPU interconnects and a one-GPU-to-one-NIC configuration, enabling up to eight 400G NICs for enhanced scalability and performance.

The 4U 8000A-E13P server is another key model, featuring dual EPYC 9005 processors and support for up to eight double-slot GPUs (up to 600W), offering vendor flexibility. It’s also fully compatible with NVIDIA’s MGX architecture, which facilitates rapid deployment for enterprise AI infrastructures. With an NVIDIA 2-8-5 topology (CPU-GPU-DPU/NIC) and four high-bandwidth PCIe® NICs, this server is optimized for system performance and efficient data traffic.

Also on display will be the RS520QA-E13, a 2U, four-node high-density server designed for cloud environments and electronic design automation (EDA). Each node is powered by an EPYC 9005 processor and supports two Compute Express Link (CXL) memory expansion modules, offering up to 12 + 8 DIMMs for greater memory capacity and speed. This server, with up to 400W TDP and efficient air-cooling, ensures strong thermal performance, while its front-access design streamlines maintenance.

For those leaning towards Intel solutions, ASUS will present the 2U RS720-E1 server, which supports Intel Xeon 6 processors and up to three dual-slot GPUs. The 7U ESC I8-E11 server, powered by two 5th Gen Intel Xeon Scalable processors, supports up to eight Intel Gaudi 3 accelerators, ideal for AI workloads. Its modular design minimizes cable usage, improving assembly speed and thermal efficiency.

Session Details

Attendees can catch ASUS’s 15-minute session on October 16, from 10:25 to 10:35. The session will focus on the Data Center Modular Hardware System (DC-MHS) developed by OCP, offering flexible, scalable, and easier-to-maintain solutions for modern data centers.

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